迷你PC Intel原装NUC8i7HVK与第8代英特尔核心处理器i7-8809G双局域网
更新:2023-11-13 18:25 编号:25313203 发布IP:123.117.78.113 浏览:29次- 发布企业
- 北京天开创新技术有限公司商铺
- 认证
- 资质核验:已通过营业执照认证入驻顺企:第19年主体名称:北京天开创新技术有限公司组织机构代码:91110108748142308A
- 报价
- 人民币¥5100.00元每件
- 关键词
- TEKET,NUC8i7HVK,i7-8809G,NUC,迷你电脑
- 所在地
- 中国北京市海淀区上地信息路1号2号楼20层2004室
- 联系电话
- 86 010 82894802/82894808
- 手机
- 13810249588
- 联系人
- 陈颖 请说明来自顺企网,优惠更多
详细介绍
https://www.intel.com/content/www/us/en/products/boards-kits/nuc/kits/nuc8i7hvk.html?wapkw=NUC8i7HVK
NUC8i7HVK
Technical Specifications
Essentials
StatusLaunched
Produchttps://www.intel.com/content/www/us/en/products/boards-kits/nuc/kits/nuc8i7hvk.html?wapkw=NUC8i7HVK
NUC8i7HVK
Technical Specifications
Essentials
StatusLaunched
Product CollectionIntel® NUC Kit with 8th Generation Intel® Core™Processors
Launch Date Q1'18
Supported Operating SystemsWindows 10, 64-bit*, Windows Server2016*
Board NumberNUC8i7HVB
Board Form FactorUCFF (5.5" x 8")
SocketSoldered-down BGA
Internal Drive Form FactorM.2 SSD
# of Internal Drives Supported2 t CollectionIntel® NUC Kit with 8thGeneration Intel® Core™ Processors
Launch Date Q1'18
Supported Operating SystemsWindows 10, 64-bit*, Windows Server2016*
Board NumberNUC8i7HVB
Board Form FactorUCFF (5.5" x 8")
SocketSoldered-down BGA
Internal Drive Form FactorM.2 SSD
# of Internal Drives Supported2
Intel® NUC Kit UC8i7HVK
Essentials
Product Collection
Intel® NUC Kit with 8th Generation Intel® Core™ Processors
https://www.intel.com/content/www/us/en/products/boards-kits/nuc/kits/nuc8i7hvk.html
NUC8i7HVK
Technical Specifications
Essentials
StatusLaunched
Product CollectionIntel® NUC Kit with 8th Generation Intel® Core™Processors
Launch Date Q1'18
Supported Operating SystemsWindows 10, 64-bit*, Windows Server2016*
Board NumberNUC8i7HVB
Board Form FactorUCFF (5.5" x 8")
SocketSoldered-down BGA
Internal Drive Form FactorM.2 SSD
# of Internal Drives Supported2
Lithography 14 nm
TDP 100 W
DC Input Voltage Supported19 VDC
Board ChipsetMobile Intel® HM175 Chipset
Processor IncludedIntel Core™ i7-8809G Processor
Warranty Period 3 yrs
Supplemental Information
Embedded Options Available No
DescriptionOther features: Includes 2x Thunderbolt 3 (40Gbps) viarearUSB-C ports, SDXC card slot and front USB-A and USB-C ports w/USB 3.1Gen 2
Memory & Storage
Max Memory Size (dependent on memory type) 32 GB
Memory Types DDR4-2400+ 1.2V SO-DIMM
Max # of Memory Channels 2
Max Memory Bandwidth 38.4 GB/s
Max # of DIMMs 2
ECC Memory Supported ‡ No
Processor Graphics ‡ Intel® HD Graphics 630
Integrated Graphics ‡ Yes
Graphics Output 2x Mini-DP 1.2, 2x Thunderbolt 3, F+R HDI 2.0a
# of Displays Supported ‡6
Discrete GraphicsRadeon™ RX Vega M GH graphics
Expansion Options
PCI Express Revision Gen3
PCI Express Configurations ‡ Dual M.2 slots with PCIe x4 lanes
Removable Memory Card Slot SDXC with UHS-I support
M.2 Card Slot (wireless) 2230
M.2 Card Slot (storage) 22x42/80, 22x80
I/O Specifications
# of USB Ports13
USB ConfigurationF: USB3, 2x USB 3.1g2 (Type A and C); R: 4x USB3,2xThunderbolt3 (USB3.1g2); INT: 2x USB2, 2x USB3
USB Revision 2.0, 3.0, 3.1 Gen2
USB 2.0 Configuration (External + Internal)0 + 2
USB 3.0 Configuration (External + Internal)1F, 4R, 2i
Total # of SATA Ports 2
Max # of SATA 6.0 Gb/s Ports2
RAID Configuration 2x M.2 SATA/PCIe SSD (RAID-0 RAID-1)
Audio (back channel + front channel)7.1 digital; L+R+mic (F);L+R+TOSLINK(R)
Integrated LAN Intel® Ethernet Connection i219-LM and i210-AT
Integrated Wireless‡Intel® Wireless-AC 8265 + BT 4.2
Integrated BT Yes
Consumer Infrared Rx Sensor Yes
S/PDIF Out ConnectorTOSLINK
Additional Headers CEC, 2x USB2.0, 2x USB 3.0, FRONT_PANEL
# of Thunderbolt™ Ports 2x Thunderbolt™ 3
Package Specifications
Chassis Dimensions221 x 142 x 39mm
Advanced Technologies
Intel® Virtualization Technology for Directed I/O (VT-d) ‡ Yes
Intel vPro® Platform Eligibility ‡ No
TPM No
Intel® HD Audio Technology Yes
Intel® Rapid Storage Technology Yes
Intel® Virtualization Technology (VT-x) ‡ Yes
Intel® Platform Trust Technology (Intel® PTT) Yes
Security & Reliability
Intel® AES New Instructions Yes
成立日期 | 2012年11月05日 | ||
法定代表人 | 易江涛 | ||
注册资本 | 400 | ||
主营产品 | 嵌入式工业主板,工业计算机,MINI PC,机箱,ATX电源,SSD,液晶屏,触摸屏,VFD前置板,红外线遥控器,无线键盘,激光笔演示器 | ||
经营范围 | 技术开发、技术推广、技术转让、技术咨询、技术服务;委托加工计算机主板、迷你电脑、控制与通讯设备、电子产品;计算机软件开发;计算机系统服务;销售计算机、软件及辅助设备、电子产品、机械设备、日用品、口罩(非医用)、医疗器械I类、医疗器械II类;委托加工口罩(非医用);货物进出口、技术进出口、代理进出口。(企业依法自主选择经营项目,开展经营活动;依法须经批准的项目,经相关部门批准后依批准的内容开展经营活动;不得从事本市产业政策禁止和限制类项目的经营活动。) | ||
公司简介 | 北京天开创新技术有限公司(TEKETINNOVATION)成立于2003年3月,2003-2009年被评为北京市科学技术委员会和中关村科技园区海淀园区认证的高新技术企业,有自营进出口权,增值税一般纳税人,生产型出口退税企业,经营模式以OEM和ODM为主。十多年来,天开创新一直专注于行业应用MINIPC及配套零部件包括小尺寸主板、机箱、电源、闪存、液晶屏及和触摸屏的开发与生产,应用于嵌入式工控、AT ... |
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